2011 IEEE SW Test Workshop
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TABLE OF CONTENTS
Tutorial - Statistical Practices for Wafer Sort Applications
Dinner Session - Keynote
Opening Session - Year in Review / Chairman's Welcome
Session 1 - Probe Challenges
Session 2 - Optimization / Process Analysis
Session 3 - Power Probing
Session 4 - High Performance Probing
Session 5 - Spring Pin Probing
Session 6 - Probe Potpourri
Session 7 - High Temperature / Extreme Probing
Session 8 - RF Probing
Session 9 - Productivity / COO
Session 10 - Probe Process Infrastructure

 

Tutorial Session - "Statistical Practices for Wafer Sort Applications"

Lance MILNER
(Intel Corporation)

 

  



Dinner Session
 Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10
Keynote Speaker - "Backend to the Front Line"

William T. CHEN, Ph.D.
ASME Fellow / IEEE Fellow
Senior Technical Advisor and Fellow
(ASE Group) 		   



Chairman's Welcome and Workshop Overview
 Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

"Welcome to Semiconductor Wafer (IEEE SW Test) Workshop 2011"

Jerry BROZ, Ph.D.
General Chair
(SW Test Workshop)

  

 



Session 1 - Probe Challenges
 Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

Winner - Best Data Presentation
 "Use of Harsh Wafer Probing to Evaluate Various Bond Pad Structures"

Stevan HUNTER, Troy RUUD, Bryce RASMUSSEN and Vail MCBRIDE
(ON Semiconductor � USA)

 


"A Flexible Vertical MEMs Probe Card Technology  for Pre-Bump and eWLP Applications"
Rick MARSHALL and Mike SLESSOR, Ph.D.
(MicroProbe - USA)

 


"Evaluation of New Probe Technology on Various Bump Materials"
Amy LEONG
(MicroProbe Inc - USA)		 Alexander WITTIG
(Global Foundries - Dresden)

 Darko HULIC
(Nikad)



Session 2 - Optimization / Process Analysis
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

"Probe to Pad Placement Error Correction for Wafer Level S-Parameter Measurements"

Steven ORTIZ
(Avago Technologies - USA) 		 

 


"Achieving Low-Risk, Volume Manufacturing on Leading Edge Technology Probecards;  Definition and Methodology for Implementing a Process Control System"

Douglas SOTTOWAY and Anil KAZA, Ph.D.
(Intel, Corp. - USA) 		 

 


Winner - Most Inspirational Presentation
 "Novel carbonaceous film with high electrical conductivity and super high hardness for semiconductor test probes"

Teruyuki KITAGAWA, Ph.D.
(Nomura Plating Co., Ltd. - Japan)

 

 



Session 3 - Power Probing
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

 "A HOT Topic: Current Carrying Capacity, Tip Melting and Arcing"

Michael HUEBNER, Ph.D.
(FormFactor - USA) 		   


Co-Winner - Best Presentation, Tutorial in Nature
 "Key Design Parameters to Maximize Probe Current Carrying Capability"

January KISTER
(MicroProbe - USA) 		   


"Aspects of High Power Probing"

Rainer GAGGL, Ph.D.
(T.I.P.S. Messtechnik GmbH - Austria) 		   


"Power Delivery Network Analysis � A case for true 3D simulations"

Gert HOHENWARTER
(GateWave Northern, Inc. - USA) 		   



Session 4 - High Performance Probing
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

 "Testing Probe Cards That Contain Complex Circuitry"

Bob DAVIS, Greg OLMSTEAD, and Jeff GREENBERG
(Rudolph Technologies - USA) 		 

 


"A smart probe-card data base, a key for success"

Dominique LANGLOIS and Julien HARRAULT
(ALTIS - France) 		   

 

"Wafer Probing on Fine-Pitch Micro-Bumps for 2.5D- and 3D-SICs"

Erik Jan MARINISSEN,
Tom DAENEN, Luc DUPAS,
and Marc VAN DIEVEL
(IMEC Research Institute - Belgium) 		Peter HANAWAY, Ken SMITH, and Eric STRID
(Cascade Microtech - USA)

J�rg KIESEWETTER and Thomas THAERIGEN
(Cascade Microtech GmbH - Germany)



Session 5 - Spring Pin Probing
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

"WSP-Wafer Socket Probe for Flip Chip Applications"

Brandon MAIR and Norman ARMENDARIZ, Ph.D. (Texas Instruments, Inc. - USA)

 


"Wafer-Scale Contactor Development and Deployment"
Jim BRANDES
(Multitest - USA) 		   


"Multi-point Probe Contacts for Flip Chip Wafer Level Probing"

Norman ARMENDARIZ, Ph.D., and James TONG
(Texas Instruments, Inc. - USA) 		 


"A new 3D laser bonding process for single spring attach on 300mm probe cards"

Thorsten TEUTSCH
(Pac Tech USA - USA) 		Ghassem AZDASHT and Jens OESTERDIEKHOFF
(Pac Tech GmbH - Germany)



Session 6 - Probe Potpourri
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

 "The Development of a Flexible and Efficient Chip Thermal Imaging Capability"

Marc KNOX, Alan WEGER, and Xiaojin WEI
(IBM - USA) 		   


"Electromechanical Design of Spring Pin Based WLCSP Contact Engine and Its Effect on Signal Fidelity"

Mike FREDD
(Cascade Microtech - USA) 		   

 

"Novel Vertical MEMS Probe Card for High Speed Devices"

Behrouz SADRABADI
(Qualmax America, Inc. - USA) 		John LEE
(Gigalane Co., Ltd. - South Korea)



Session 7 - High Temperature / Extreme Probing
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

 "MSO - Multi-Site Optimizer"

Kevin FREDRIKSEN
(SPA GmbH - Germany) 		 

 


Co-Winner - Best Technical Presentation
"Identification, analysis, and control of high temperature influences on wafer test probing processes"

Marcel BLEYL and Jan MARTENS
(NXP Semiconductors - GmbH) 		Darren JAMES
(Rudolph Technologies - USA)


"Ultra High Temperature Probing"

E. DANIELS, Eddie MCCLANAHAN and Sai SRINIVASAN
(Texas Instruments, Inc. � USA)

 


Co-Winner - Best Technical Presentation
"Contact formation in wafer test probing - Fritting, Breakdown, Pad Damage and Conduction"

Joerg SEEKAMP
Gunther BOEHM
(Feinmetall GmbH) 		Jan MARTENS
(NXP Semiconductors GmbH)		 Marcel MITTAG
(Fraunhofer Institut fur
Werkstoffmechanik - Germany)



Session 8 - RF Probing
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

"High Bandwidth (>2.5Gbps) and Fine Pitch (<30um) Cantilever Probe Card"

Seenew LAI
(MPI - Taiwan) 		Keith KOU
(Raydium Semiconductor Corporation - Taiwan) 		 


"High Density and High Speed Approach for Probe Card PCB"
Takashi SUGIYAMA
(Hitachi Chemical Co. Ltd. - Japan) 		 


Co-Winner - Best Presentation, Tutorial in Nature
 "High Frequency Probe"

Cristian GOZZI
(TechnoProbe - Italy)

 


"An Advanced Cantilever Probe Card with 6GHz Bandwidth for RFIC Wafer Testing"

John HUANG, Jamie PAN, and Wei XIONG
(Innofidei - Taiwan)		 Phil HSIEH, Morgan KU, and Huang KENGYI
(MPI - Taiwan) 		 

 


 Session 9 - Productivity / COO
Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10

 "Ghosting - Touchdown Reduction Using Alternate Site Sharing"

Doron AVIDAR and Yossi DADI
(Micron - Israel) 		 


"Challenges of CIS High Parallel Test"

Larry LEVY
(FormFactor - USA) 		 


"Probe Card Cost Drivers from Architecture to Zero Defects"

Ira FELDMAN
(Feldman Engineering Corp. - USA) 		 

 
Session 10 - Probe Process Infrastructure
 Top | Session 1 | Session 2 | Session 3 | Session 4 | Session 5 | Session 6 | Session 7 | Session 8 | Session 9 | Session 10


"Pattern Searching for Failing Die"

Richard TUTTLE
(Avago Technologies - USA)		  


"Methods for Improved Probe Mark Quality"

Didier BAUMANN and Robert DIPERI
(ST Microelectronics - France) 		Bertrand Le CALVEZ and Francois GIX
(Synergie Cad Probe - France)


"The Probe Card Analyzer M5"

Oscar Beijert
(BE Precision Technology- The Netherlands)		  

 

 

 

SWTW 2011 Chairs:

  • Dr. Jerry Broz, International Test Solutions, General Chair

  • Rey Rincon, Freescale Semiconductor, Technical Program Chair

  • Maddie Harwood, CEM America, Inc.,Finance Chair

  • Meredith M. Griffith, CEM America, Inc., Registration / EXPO Coordinator

SWTW 2011 Committee:

  • Jan Martens, NXP Semiconductor, Program Committee
  • Darren James, Rudolph Technologies, Program Committee
  • Patrick Mui, JEM America, Program Committee
  • Fred Taber, BiTS Workshop, Proceedings Coordinator
  • Roy Swart, Intel, Steering Committee
  • Gunther Boehm, FeinMetall GmbH
  • John Caldwell, Micron Technology
  • Boyd Daniels, Texas Instruments
  • Michael Huebner, Ph.D., FormFactor
  • Tatsuo Inoue, Micronics Japan (MJC)
  • Amy Leong, Microprobe
  • Mark Ojeda, Spansion

 
 

The presentations included in the SWTW proceedings reflect the authors opinions and are presented without change. Inclusion in the proceedings does not constitute an endorsement by the SouthWest Test Workshop Committee, IEEE CPMT Society, IEEE Computer Society or the IEEE Test Technology Council.

Papers previously copyrighted or with copyright restrictions cannot be presented. In keeping with a workshop environment and to avoid copyright issues, SWTW does not officially seek a copyright ownership / transfer from authors. Authors agree by submitting their work that their presentation is original work and substantially not published previously or copyrighted, may be referenced in the work of others, will be assembled / distributed in the SWTW Proceedings, and made available for download by anyone from the SWTW website.
 

 

� 2011 swtest.org      |      last modified 07/14/2011