2012 IEEE SW Test Workshop
|
| Doug Sottaway (Intel Corporation) |
|
Dinner Session
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8 |
Session 9
Keynote Speaker - "Emerging
High Density 3D Through Silicon Stacking (TSS) � What�s Next?"
|
Matt Nowak
Senior Director, Advanced Technology (Qualcomm CDMA Technologies) |
Chairman's Welcome and Workshop Overview
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8 |
Session 9
"Welcome
to Semiconductor Wafer (IEEE SW Test) Workshop 2012"
| Jerry Broz, Ph.D. (SW Test General Chair) |
|
Session 1 - Process Improvements for HVM
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8 |
Session 9
Winner - Best Presentation,
Tutorial in Nature
"Crossover
in TD efficiency - When brick wall is not the best."
|
Keith Breinlinger, Ph.D. (FormFactor, Inc.) |
|
"Floating
touchdown � new methodology for high parallelism testing driving test time
reduction"
|
Doron Avidar (Micron - Israel) |
|
Co-Winner - Best Data Presentation
"Wafer
probe challenges for the automotive market"
|
Luc Van Cauwenberghe
(ON Semiconductor � Belgium) |
Session 2 - Optimizing Probe Depth
Performance
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8 |
Session 9
"Actual
vs. Programmed Over Travel for Advanced Probe Cards"
|
Tommie Berry (FormFactor, Inc.) Keith Breinlinger, Ph.D. (FormFactor, Inc.) Rey Rincon (Freescale Semiconductor) |
|
"Aluminum
Probe Pad Thickness and Properties for Stable Parametric 'Probe-Ability'"
|
Bernd Bischoff (Texas
Instruments - Germany) |
|
"Comparison
of Bond Pad Cracking in Harsh Probing with Three Different Probe Cards"
| Stevan Hunter (ON Semiconductor - Pocatello, USA) |
|
|
Session 3 -
Probe Potpourri
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8 |
Session 9
"Is
parametric testing about to enter a period of growth and innovation?"
| Larry Levy (FormFactor, Inc.) |
| John West (VLSI Research Europe - United Kingdom) |
"Wafer
Map Failure Pattern Recognition Using Artificial Intelligence"
|
Wee Tick Lo (GLOBALFOUNDRIES - Singapore) |
"The
Road to 450 mm Semiconductor Wafers"
| Ira Feldman (Feldman Engineering Corp.) |
Session 4 - New Contactor
Technologies and RF PCB Design
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8 |
Session 9
"Are
Spring Probes Valid Below 400 Micron Pitch?"
|
Jon Diller (Interconnect Devices, Inc.) |
|
"Quantifying
the Impact of the Environment on PCB Transmission Lines"
|
Zaven Tashjian, Ph.D. (Circuit
Spectrum, Inc. |
Session 5 - New Probe Card and
Contact Technologies
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8 |
Session 9
Winner - Best Technical Presentation
"Full
Wafer Contact Breakthrough with Ultra-High Pin Count"
|
Daisuke Takano (ADVANTEST - Japan) |
|
"High
Density and Low Cost Approach for the PCB of semiconductor tester"
|
Takashi Sugiyama (Hitachi
Chemical Co.,Ltd. - Japan)
|
"LIGA
and its Application to Electrical Interconnects"
|
Frank Schonig (Rosenberger) |
|
Raffaele Vallauri, Ph.D. (Technoprobe Spa � Italy) |
|
Robert Stampahar (SV Probe - An
Ellipsiz Company) |
| Gert Hohenwarter, Ph.D. (GateWave Northern, Inc.) |
"Improved
Cantilever Probing - Minimizing Scub Marks"
|
Rey Rincon (Freescale Semiconductor) Stefano Felici (TechnoProbe - USA) |
|
Jose Horas (Intel Mobile
Communications - Germany) |
|
"Advanced
Cu-Pillar Applications at 50um - Enabling Fine Pitch Probing"
|
Senthil Theppakuttai, Ph.D. (SV
Probe) |
"Test
and Measurement Challenges for 3D IC Development"
| Raphael Robertazzi, Ph.D. (IBM Research) |
|
Winner -
Most Inspirational Presentation
"An
analysis of probing CRES in Gold bumping pad using Automatic Test
Equipment"
|
Chang Hyun (Samsung
Semiconductor Institution Technology) |
| Rob Marcelis (BE Precision Technology - Netherlands) |
|
Richard Portune (DCG Systems, Inc.) |
|
John Strom (Rudolph
Technologies) |
|
Session 9 - Productivity / COO
Top | Session 1
| Session 2 | Session 3 |
Session 4 | Session 5 |
Session 6 | Session 7 | Session 8 |
Session 9
"Unique
characteristics of the novel carbonaceous film with high electrical
conductivity and ultra high hardness for semiconductor test probes"
| Teruyuki Kitagawa, Ph.D. (Nomura Plating, Co., Ltd. � Japan) |
|
Jim Brandes (Multitest) |
|
Samuel Pak (IWIN
CO.,Ltd. - Korea) AJ Park (IWIN CO.,Ltd. - Korea) |
SWTW 2012 Chairs:
Dr. Jerry Broz, International Test Solutions, General Chair
Rey Rincon, Freescale Semiconductor, Technical Program Chair
Maddie Harwood, CEM America, Inc.,Finance Chair
Meredith M. Griffith, CEM America, Inc., Registration / EXPO Coordinator
SWTW 2012 Committee:
The presentations included
in the SWTW proceedings reflect the authors opinions and are presented
without change. Inclusion in the proceedings does not constitute an
endorsement by the SouthWest Test Workshop Committee, IEEE CPMT Society, IEEE Computer
Society or the IEEE Test Technology Council.
Papers previously copyrighted or with copyright restrictions cannot be
presented. In keeping with a workshop environment and to avoid copyright
issues, SWTW does not officially seek a copyright ownership / transfer
from authors. Authors agree by submitting their work that their
presentation is original work and substantially not published previously
or copyrighted, may be referenced in the work of others, will be
assembled / distributed in the SWTW Proceedings, and made available for
download by anyone from the SWTW website.
� 2012 swtest.org | last modified 08/10/2012