IEEE SEMICONDUCTOR WAFER TEST WORKSHOP 2014

(Each presentation is in Adobe Acrobat format)

TABLE OF CONTENTS


Keynote Session


Session #1 - Characterizing the Touchdown and the Damage


Session #2 - High Voltage, High Temperature, High Current


Session #3 - Design & Testing Advanced Probecards


Session #4 - Advanced Vertical Technologies


Session #5 - Fine-Pitch Bump Probing


Session #6 - Selection, Use and Repair of Probecards


Session #7 - Challenges of Wafer Level Chip Scale Test


Session #8 - Cost of Ownership

Mr. Rey Rincon (Freescale Semiconductor, USA)

Session #9 - Probe Potpourri

SESSION CHAIR : REY RINCON (FREESCALE SEMICONDUCTOR - AUSTIN, USA)



Steering Committee Members for SW Test 2014:


Dr. Jerry Broz, Ph.D., International Test Solutions, General Chair 
Rey Rincon, Freescale Semiconductor, Technical Program Chair 
Maddie Harwood, CEM Inc., Finance Chair 
John Caldwell, Micron Technology, Program Committee
Darren James, Rudolph Technologies, Program Committee
Jan Martens, Consultant, Program Committee
Patrick Mui, JEM America, Program Committee
Fred Taber, BiTS Workshop, Proceedings Coordinator
Karen Armendariz, Celadon Systems
Gunther Boehm, FeinMetall GmbH
Stevan Hunter, Ph.D., ON Semiconductor and Idaho State University
Michael Huebner, Ph.D., FormFactor
Tatsuo Inoue, Micronics Japan (MJC)
Amy Leong, FormFactor, Inc.
Clark Liu, Powertech Technology, Inc. (PTI)
Mark Ojeda, Spansion
Joey Wu, MPI Corporation
Al Wegleitner, Texas Instruments, Inc.

The presentations included in the SWTW proceedings reflect the authors opinions and are presented without change. Inclusion in the proceedings does not constitute an endorsement by the SouthWest Test Workshop Committee, IEEE CPMT Society, IEEE Computer Society or the IEEE Test Technology Council.


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