2016 SW Test Workshop - Technical Program

Awarded Presentations

Best Overall Presentation - Probing Cu Pillar Applications w/ Vertical Technologies
- Author: Brandon Mair (Texas Instruments)
Best Data Presentation - AMD High Pin Count Probing Challenges on Leading Edge GPU
- Authors: Foo Xin Reng (AMD), Raffaele Vallauri (Technoprobe) and Claus Ploetz (Advantest)
(Tie) Best Presentation, Tutorial in Nature - Production Test RF Calibration for Multi-DUT Probe Cards: How to Get the Most Accurate Measurements
- Author: Daniel Bock, Ph.D. (Cascade Microtech)
(Tie) Best Presentation, Tutorial in Nature - Tutorial on the Effects of Probe Marks on Wirebonding
- Author: Stevan Hunter, Ph.D. (ON Semiconductor) and Priscila Brown (BYU Idaho)
“Most Inspirational” Presentation - Automated Probe Card Exchange and Docking for RADAR Products
- Author: Jory Twitchell (NXP Semiconductor)

Keynote Presentation

Test and Validation in an Analog and Embedded Environment Along with the Challenges and Limitations in the Test Development Process
- Dr. Friedrich Taenzler, Senior Member of Technical Staff
  Texas Instruments

Technical Tutorials

Session Chair : Mr. Rey Rincon (NXP Semiconductor – Austin, TX, USA)

Understanding the Probe Damage Risk thru Determination of Minimum Bond Pad Opening Capability of Different Prober and Needle Type Set-up
- Mr. Wiljelm Carl Olalia (ON Semiconductor Philippines, Inc. – Carmona, Philippines)
Analysis for Pre-Mature Worn-out of Vertical Probe Needle
- Mr. Wiljelm Carl Olalia (ON Semiconductor Philippines, Inc. – Carmona, Philippines)
Reducing Probe Needle Damage on Bond Pad Using Six Sigma Methodology
- Mr. Glenn Placido (ON Semiconductor Philippines, Inc. – Carmona, Philippines)
Tutorial on the Effects of Probe Marks on Wirebonding
- Ms. Priscila Brown (Brigham Young University Idaho – Rexburg, ID, USA) Dr. Stevan Hunter (ON Semiconductor – Phoenix, AZ, USA)
- Dr. Stevan Hunter (ON Semiconductor – Phoenix, AZ USA)

Session #1 - Test Strategy Innovations

Session Chair : Jerry Broz, Ph.D. (SW Test General Chair)

Welcome to SW Test 2016!
- Jerry Broz, Ph.D. (SW Test General Chair)
AMD High Pin Count Probing Challenges on Leading Edge GPU: Technoprobe TPEG™ MEMS vs. Cobra
- Mr. Foo Xin-Reng (AMD – Singapore, Singapore)
- Mr. Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy)
Verification of High-Bandwidth-Memory (HBM) through direct probing on MicroBumps
- Mr. Marc Loranger (Form Factor Inc – Livermore, CA, USA)
- Mr. Sung-wook Moon (SK hynix – Icheon, Korea)
Automated Testing of Bare Die-to-Die Stacks
- Mr. Erik Jan Marinissen (IMEC – Leuven, Belgium) Mr. Bart De Wachter (IMEC – Leuven, Belgium) Mr. Teng Wang (IMEC – Leuven, Belgium) Mr. Joerg Kiesewetter (Cascade-Microtech – Sacka, Germany) Mr. Jens Fiedler (Cascade Microtech – Sacka, Germany) Mr. Karsten Stoll (Cascade Microtech – Sacka, Germany)
- Mr. Daniel Rishavy (Cascade Microtech – Austin, TX, USA)

Session #2 - Drilling

Session Chair : Mr. Joey Wu (MPI Corp – Chupei, Taiwan)

Advanced Laser Bonding of Ultra Fine Pitch Cantilever Spring Pins for Assembly of Flash, DRAM and Logic Probe Cards
- Mr. Thomas Oppert (PacTech-Packaging Technologies GmbH – Nauen, Germany)
SMART Laser Drilling for Advanced Vertical Probe Card Manufacturing
- Dr. Alan Ferguson (Oxford Lasers – Didcot, U.K.) Dr. Martyn Knowles (Oxford Lasers – Didcot, U.K.) Dr. Andrew Kearsley (Oxford Lasers Ltd. – Didcot, U.K.) Mr. Michael Gaukroger (Oxford Lasers Ltd. – Didcot, U.K.) Mr. Dimitris Karnakis (Oxford Lasers – Didcot, U.K.) Mr. Riccardo Geremia (Oxford Lasers – Didcot, U.K.) Mr. Simon Touhy (Oxford Lasers – Didcot, U.K.) Mr. Michael Cullimore (Oxford Lasers – Didcot, U.K.)
- Dr. Alan Ferguson (Oxford Lasers – Didcot, U.K.)
Innovative Laser Processing and Drilling Techniques for Future Probe Card Applications
- Mr. Hung-Lung Chen (KJet Laser Tek Inc. – HsinCHu City, Taiwan)

Session #3 - New Testing Challenge and Solution

Session Chair : Mr. Clark Liu (PTI – HsiChu, Taiwan)

Thermal Testing of Singulated Devices Get Us Closer to Known-Good Die/Stack
- Mr. David Armstrong (Advantest – Lafayette, IN, USA)
Robotisation and Test of image sensors
- Mr. Philippe Sandri (E2V – Saint Egreve, France)
Achieving Higher Speeds for CMOS Image Sensor Testing
- Mr. Minoru Mikami (FormFactor – Yokohama-shi, Japan)
- Mr. Larry Levy (FormFactor – Livermore, CA, USA)

Session #4 - Bump and Array

Session Chair : Michael Huebner (FormFactor – Livermore, CA, USA)

Probing for WLP Evaluation
- Mr. Clark Liu (PTI – HsiChu, Taiwan)
GLOBALFOUNDRIES and MPI Pre-bump probing challenges: MPI inter-changeable pre-bump probe solution
- Mr. Qu Yang (Globalfoudries – Singapore)
Managing Hardware Cost for Large Area Array C4 Bump/Cu Pillar SOC Applications using Improved MEMS Methodology
- Mr. Michael Chrastecky (BucklingBeam Solutions LLC – Hutto, TX, USA)

Session #5 - Moving Forward with Space Transformer Technology

Session Chair : Mr. Frederick Taber (Taber Consulting – LaGrangeville, NY, USA)

Optimization for Polyimide Circuit Design of Space Transformer on Probecard
- Tae Kyun Kim (MICROFRIEND INC – Korea)
Vertical Probe Card : Probe Head for Improved SI/PI
Mr. Jung Keun Park (Willtechnology – Suwon, Korea)
Production Test RF Calibration for Multi-DUT Probe Cards: How to Get the Most Accurate Measurements
- Mr. Daniel Bock (Cascade Microtech – Beaverton, CO, USA)
Automated Probe Card Exchange and Docking for RADAR Products
- Mr. Jory Twitchell (NXP Semiconductor – USA)

Session #6 - Power Probing @ Temperature

Session Chair : Mr. Gunther Boehm (FEINMETALL GmbH – Herrenberg, Germany)

Invited Paper: Customized Probe Card for On-Wafer Testing of AlGaN/GaN Power Transistors
- Mr. Bryan Root (Celadon Systems, Inc. – Burnsville, MN, USA)
GLOBALFOUNDRIES High and Low Temperature Probing Challenges: Technoprobe Probing Solution
- Ms. Joy Chang (Globalfoundries – Woodlands, Singapore) Ms. Hellen Kee (Technoprobe – Singapore, Singapore) Mr. Marco Prea (Technoprobe S.p.A., Italy) Mr. Guo Chang Man (Globalfoundries – Woodlands, Singapore) Mr. Jeffery Lam (Globalfoundries – Woodlands, Singapore)
- Mr. Raffaele Vallauri (Technoprobe Spa – Cernusco Lombardone, Italy) Ms. Yah Ean Koh (Globalfoundries – Woodlands, Singapore)
High Voltage, High Current, High Temperature – and Sometimes All Come Together at the Same Time…
- Dr. Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Villach, Austria)

Session #7 - Probecard Potpourri

Session Chair : Mr. Mark Ojeda (Cypress Semiconductor – San Jose, CA, USA)

Multi-site Probing of Magnetic Sensors at 175 deg C
- Mr. Geert Gouwy (Melexis – Leper, Belgium)
General Overview on Pad Damage: Probe Key Parameters and Other Causes
- Mr. Riccardo Vettori (Technoprobe SPA – Cernusco Lombardone (LC) , Italy)
Automated Thermal Drift Correction of Discrete Probes on Motorized Positioners for Device Characterization
- Mr. Joe Frankel (Cascade Microtech – Beaverton, CO, USA) Mr. Koby Duckworth (Cascade Microtech – Beaverton, CO, USA)
- Mr. Joe Frankel (Cascade Microtech – Beaverton, CO, USA) Mr. Koby Duckworth (Cascade Microtech – Beaverton, CO, USA)

Session #8 - Vertical, CU Pillar and ILD Cracking during Probe

Session Chair : Mr. Alan Wegleitner (Texas Instruments – Dallas, TX, USA)

A New Approach to Low Pin Count Products Test Found Vertical Probes to be Superior to Cantilever
- Mr. Franz Steger (Texas Instruments Deuschland GmbH – Freising, Germany)
Probing Cu Pillar Applications w/ Vertical Technologies
- Mr. Brandon Mair (Texas Instruments – Dallas, TX, USA)
Interlayer Dielectric (ILD) Cracking Mechanisms and Their Effects on Probe Processes
- Mr. Daniel Fresquez (Texas Instruments Inc. – Dallas, TX, USA)
A Customized Additional Advanced Loopback technology on Vertical Probe Card
- Mr. Alex Wei (MPI Corporation – Zhubei, Taiwan)

Session #9 - Process Improvement

Session Chair : Mr. Patrick Mui (JEM America – Fremont, CA, USA)

A Probe Card Metrology Process Enabling Fast Feedback Loops to Reduce Operational and Maintenance Related Cost
- Mr. Martin Kunz (NanoFocus AG – Oberhausen, Germany) Dr. Jörg Nannen (NanoFocus AG – Oberhausen, Germany)
- Mr. Martin Kunz (NanoFocus AG – Oberhausen, Germany)
Sustaining and Improving Obsolete Test Systems
- Mr. Carl Scharrer (Texas Instruments, Inc – Dallas, TX, USA)

Steering Committee Members for SW Test 2016:

Dr. Jerry Broz, Ph.D., International Test Solutions, General Chair
Rey Rincon, NXP Semiconductor, Technical Program Chair
Maddie Harwood, CEM Inc., Finance Chair
John Caldwell, Micron Technology, Program Committee
Darren James, Consultant, Program Committee
Jan Martens, Consultant, Program Committee
Patrick Mui, JEM America, Program Committee
Fred Taber, BiTS Workshop, Proceedings Coordinator
Karen Armendariz, Celadon Systems
Gunther Boehm, FeinMetall GmbH
Stevan Hunter, Ph.D., ON Semiconductor and Idaho State University
Michael Huebner, Ph.D., FormFactor
Amy Leong, FormFactor, Inc.
Clark Liu, Powertech Technology, Inc. (PTI – Taiwan)
Gary Maier, IBM Corporation
Mark Ojeda, Spansion
Joey Wu, MPI Corporation (Taiwan)
Al Wegleitner, Texas Instruments, Inc.
Sang Kyu (SK) Yoo, Samsung Electronics – Korea

The presentations included in the SWTW proceedings reflect the authors opinions and are presented without change. Inclusion in the proceedings does not constitute an endorsement by the SouthWest Test Workshop Committee.

Papers previously copyrighted or with copyright restrictions cannot be presented. In keeping with a workshop environment and to avoid copyright issues, SWTW does not officially seek a copyright ownership / transfer from authors. Authors agree by submitting their work that their presentation is original work and substantially not published previously or copyrighted, may be referenced in the work of others, will be assembled / distributed in the SWTW Proceedings, and made available for download by anyone from the SWTW website.

SEMICONDUCTOR WAFER TEST WORKSHOP 2016

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