SWTest 2021 Program

William Miller
Vice President of EngineeringQualcomm Technologies, Inc.

Hans Stork, PhD
Senior Vice President and CTO
ON Semiconductor

The Digital Revolution: NRZ to PAM4

Author/Presenter: David Raschko (FormFactor – USA)

An Advanced Contact Solution Probe Card for RF & 5G using MEMS Coaxial Technology

Authors/Presenters: Tae Kyun Kim (Microfriend – Korea), Svetlana Garcia, PhD (Nidec SV TCL USA), Jong Gwan Yook (Yonsei Univ. – Korea) and Yong Ho Cho (Microfriend – Korea)

55GHz Octal-site Wafer Test Probecard for 5G mmWave devices

Author/Presenter: Jason Mroczkowski (COHU – USA)

Millimeter-Wave Signal Integrity in a Dense Device-Interface-Board (DIB) Environment

Author/Presenter: Andrew Westwood (Teradyne, Inc. – USA)

Exploring Parametric and Test Structure Challenges

Author/Presenter: Mike Palumbo (Technoprobe – USA)

Evaluation of a MEMS Probing Solution for Scrub Mark Visibility on Automotive Devices with Nickel Palladium pads

Authors/Presenters: Karan Maniar (Nidec SV TCL – USA), Kyle Cotner (Nidec SV TCL – USA), Erwin Verardi (STMicroelectronics – Italy), Mattia De Nicola (STMicroelectronics – Italy)

Towerless vs Towered Probe Solutions; What is the most effective application for my wafer test interface?

Authors/Presenters: William Wyckoff (inTEST EMS – USA), Wally Haley (Qualcomm – USA)

Production Parametric Probe – An Essential Guide to Lowering Cost of Test While Probing Very Small Pads

Authors/Presenters: Riley Kaiser (Celadon Systems – USA), Karen Armendariz (Celadon Systems – USA), Jungtae Hwang (Global Foundries – USA)

Challenges of Expanding Large Area Active Array for Fine Pitch Vertical Probecards

Authors/Presenters: Cameron Harker (FormFactor – USA), Yohannes Desta and Pouya Dastmalchi (FormFactor – USA)

Determine Thermal Expansion/Shrinkage Matching Between Wafer and Probe Card

Authors/Presenters: Woo Young Han (Onto Innovation – USA)

Probe to pad alignment improvement over wide temperature range for automotive applications with large probe array size, high parallelism and small pads size

Authors/Presenters: Raffaele Vallauri, Tommaso Masi, and Alessandro Cito (Technoprobe – Italy), Emanuele Bertarelli, PhD (Technoprobe – Italy), Mattia De Nicola (STMicroelectronics – Italy), Sebastien Usai (STMicroelectronics – France), Erziz Salam and Diperi Robert (STMicroelectronics – France)

Next Generation KGD Memory Test Achieved Wafer Level Speed Beyond 3GHz/6Gbps

Author/Presenter: Alan Liao (FormFactor – Livermore, USA)

Next Generation SmartMatrix Probe Card Technology Enables 3000-Parallelism 1TD Test for 1Z DRAM Process Node

Authors/Presenters: Joe Ceremuga (FormFactor – USA), Cameron Harker (FormFactor – USA)

A Vertical Probe Solution for the High-Density 5G Market

Authors/Presenters: Don Thompson (R&D Altanova – USA), Svetlana Garcia, PhD (Nidec SV TCL USA)

Evaluating the High Temperature Creep Performance of MEMS Vertical Technology Probes

Authors/Presenters: Dominik Schmidt (Translarity – USA), Raul Molina, Rambod Tabasi (Translarity – USA)

3D magnetic sensor stimulation – new solutions for wafer probing

Authors/Presenters: Georg Franz (T.I.P.S. Messtechnik GmbH – Austria), Sebastian Salbrechter (T.I.P.S. Messtechnik GmbH – Austria), Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Austria)

Solutions to New Challenges in Advanced Vertical Guide Plates

Author/Presenter: Alan Ferguson, PhD (Oxford Lasers – United Kingdom)

Probe Card Total Cost of Ownership – Consumable economics in the Era of Complexity

Authors/Presenters: Steve Ledford (Teradyne – USA), Eric Shoemaker (Teradyne – USA)

High Power Goes Vertical

Authors/Presenters: Sebastian Salbrechter (T.I.P.S. Messtechnik GmbH – Austria), Mauro Serra (CREA s.r.l. – Italy)

High Power Wafertest – how to keep the temperature under control

Author/Presenter: Klemens Reitinger (ERS electronic GmbH – Germany)

WLCSP Spring Probe Pointing Accuracy and Wobble

Author/Presenter: Bert Brost (Technoprobe – USA)

Challenges & Resolutions for Spring Probe Application in WLCSP Testing

Authors/Presenters: Tim Wooden and Frank Zhou, PhD (Smiths Interconnect – USA)