SWTest 2022 Program

Jerry Broz, PhD
SWTest General Chair,Advanced Probing Systems

John Yi
Product Engineering Organization FellowAdvanced Micro Devices (AMD)

Rebeca Jimenez
Corporate Vice President Advanced SiP Business Unit
Amkor Technology, Inc

PALYSIUM – A Revolutionary Material For Probing

Jonas Fecher, Jonas Sorg, Marc Raettig (Heraeus – Hanau, Germany)

New Ceramic Technology

Noh Tae Hyung, Paul Kim (Disruptive Innovation Technology (DIT) – Siheung, Korea)

Does Femto Laser micro machining match with guide plates and probes requirements?

Angelo Rizzo (Posalux SA – Biel/Bienne, Switzerland)

Methodology to improve WAT probe card Probe Mark and Lifetime

Eric Sik Kiang Lau, Tai Lin Goh, Tee Whay Lim (GLOBALFOUNDRIES – Singapore, Singapore), Yang Qu, Jeffrey Lam, Toh Wei Leong, Jean Tan (STAr-Quest Technologies Pte. Ltd. – Singapore, Singapore), Yu-Ming Chien (Star Technologies – Hsinchu City, Taiwan)

High Speed Digital: How to Optimize a Probe Card for PAM4 to a non-50 Ω device

Daniel Bock (FormFactor – Beaverton, USA)

Contactless Measurement of RF Voltage Distribution in Antenna Switches at High Spatial Resolution

Mathias Poik, Prof. Georg Schitter, Martin Schober (TU Wien – Vienna, Austria), Dr. Sergey Bychikhin (Alten Gmbh – Munich, Germany), Dr. Hans-Dieter Wohlmuth (Infineon Technologies AG – Neubiberg, Germany), Dr. Werner Simbürger (High Power Pulse Instruments GmbH – Haar, Germany)

55GHz Octal-site Wafer Test Probecard for 5G mmWave devices

Peter Cockburn (Cohu – Saint Paul, USA)

5G mmWave: Multi-site RF Probe Cards Enable Lower Cost-of-Test in Mass Production

Ryan Garrison (FormFactor, Inc. – Beaverton, USA)

3D IC probe card solution

Brian Chang, Paul Tai (Chunghwa Precision Test Tech.Co., Ltd. – Santa Clara)

Automated temperature calibration: Tackling the challenge of temperature accuracy and uniformity measurements in wafer probing

Bengt Haunerland (ERS electronic GmbH – Munich, Germany)

Advancing Probe Card Parallelism for SOC Devices

Johann Heitzer (Infineon – Munich, Germany), Pouya Dastmalchi, Cameron Harker (FormFactor – Livermore, USA)

The Use of Artificial Intelligence and Big Data in the Production of Advanced Vertical Guide Plates

Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom)

Control System for Enhancing the Life and Capability of Legacy, Modern and Mixed-Floor Probe Systems

Albert Soto (Soto Technologies International – Pflugerville, USA)

Probe Card Total Cost of Ownership in the Era of Complexity

Steve Ledford (Teradyne – North Reading, USA)

Assessing the Overall Cost of Ownership

Bert Brost, Mike Palumbo (Technoprobe – San Jose , USA)

Probing challenges using magnetic field

Jory Twitchell (NXP Semiconductor), Brandon Mair (TechnoProbe America)

UFO Probe ™ Card – New dimensions in wafer-level test of photonic integrated circuits

Tobias Gnausch (Jenoptik Optical Systems GmbH – Jena, Germany)

Extreme Power Probing – Challenges of 3000A and more

Diana Damian, Dr. Rainer Gaggl, Sebastian Salbrechter (TIPS Messtechnik- Austria)

Copper pad probing with vertical technologies featuring hard metal tip: ARIANNA™ probe family

Mattia De Nicola, Dr. Alberto Pagani, Erwin Verardi (STMicroelectronics – Italy) Dr. Emanuele Bertarelli, Salvatore De Siena, Raffaele Vallauri (Technoprobe – Italy)

An Advanced Method for Pad Stack Crack Assessment during Probe-Over-Active-Area

Dr. Oliver Nagler, Dr. Marianne Unterreitmeier, Dr. Eric Liau (Infineon Technologies Germany), Mark Ojeda (Infineon Technologies – USA)

On Shifting Defect Detection in Quantum Chips From Cryogenic to Ambient Temperature

Francesco Lorenzelli, Roy Li, Erik Jan Marinissen, Fahd Ayyalil Mohiyaddin, Michele Stucchi, Georges Gielen (IMEC – Leuven, Belgium)

Reducing test time by exploiting scan ATPG-based patterns targeting high density

Francesco Angione, Prof. Paolo Bernardi, Giusy Iaria, Prof. Matteo Sonza Reorda (Politecnico di Torino – Italy) Davide Appello, Giuseppe Garozzo, Vincenzo Tancorre, Roberto Ugioli (ST Microelectronics – Italy)

Novel reverse engineering way of fine pitch pre-bump probe head development in pureplay foundries to enable early-stage yield learning and DFA support via PBI/RDL MEMS technology

Dr. Jeffrey Lam, Chan Yin Hong Patrick, Chithambaram Shaalini, Chen Changqing (GlobalFoundries – Singapore, Singapore), Dr. Jeffrey Lam, Yang Qu (Star-Quest – Singapore), Dr. Choon-Leong Lou (STAr Technologies – Taiwan), Dr. Szu Huat Goh (Qualcomm)

Advances in Vertical Probing for High-Speed Digital Test at Wafer Sort

David Raschko (FormFactor – USA)

Shifting Left = More Wafer Probe

Dave Armstrong (Advantest – USA)

The semiconductor industry is fast adapting to a new reality. How can suppliers of probe cards keep up?

John West (Yole Intelligence – London, United Kingdom)

Magnetic Testing Tutorial – Wafer probing with 3D magnetic stimulation

Georg Franz (T.I.P.S. Messtechnik GmbH – Villach, Austria)

Hydra Probes – Simplifying and Standardizing Semiconductor Test

Tes Olson, Rob Stoner (Cohu – Saint Paul, USA)

Increasing transparency in wafer test probecard maintenance processes through targeted key performance indicators

Dr. Veronika Haehnel, Lasse Meyer (Infineon Technologies Dresden GmbH & Co. KG – Dresden, Germany)

Automated temperature calibration routine for prober chucks

Harald Ibele (Sigma Sensors (TCL) GmbH – Sigmaringen, Germany)

Small Pad/Small Pitch Dual-Sided Single-Level Space Transformer

Dominik Schmidt (Translarity Inc. – Fremont, USA)

Probe Debris Rating Scale

Kyle Cotner, Karan Maniar (Nidec SV TCL – Tempe, USA)

Novel Micro-Textured Film Offers Promise in Universal Handling during IC Test

Raj Varma (Gel-Pak – Hayward, USA)

Introduction of new probe, VPT (Vertical Probe Transformed)

Kazunori Kobayashi (Sinko Corporation – Niigata, Japan), Tadashi Rokkaku (Probe Innovation USA, LLC – Irving, USA)

Next Generation DRAM Temperature Requirements and Impacts to Full Wafer Contactor Probe Card Performance

Hyun Ae Lee (Samsung – Suwon, Korea), Myungjin Lee (FormFactor – Livermore, USA)