SWTest 2023 Program

Visionary Keynote

Test in the 3D NAND Zettabyte Era: How to achieve quality and minimize cost

Dr. Luca Fasoli (Western Digital), Dr. Jerry Broz (SWTest General Chair),
and Special Guest Max Lowe (Director and Photographer)

Awarded Presentations

Best Poster

Simplifying the Process of Probe Card Design Through Software Automation

Adam Schultz (Cohu-USA)

Best Presentation, Tutorial in Nature

High Heat Dissipation: Facing New Challenges with High-Power Testing at the Wafer Level

Lane Huston (Micron Technology-USA)

Most “Inspirational” Presentation (tie)

MEMS Probe Cards for Advanced High-Volume Inline Process Control Monitoring (PCM) and End-of-Line Wafer-Acceptance Tests (WAT)

Choon-Leong Lou, Yu-Ming Chien, Daniel Lo, Tee Whay Lim, Jee Fong Jong, Eric Sik Kiang Lau (STAr Technologies – Taiwan)

Flying Probe Card Design for Medical and Other Challenging Applications

Luca Fanelli (SPEA S.p.A. – Italy)

Best Data Presentation

Maximizing CCC in a Probe Card and the March to an Unburnable Probe

David Raschko and Hadi Najar (FormFactor – USA)

Best Overall Presentation

High Speed Probe Card architecture for High End Devices

Xin-Reng Foo and Chee Hoe Lin (AMD – Singapore)

People’s Choice Award

Maximizing CCC in a Probe Card and the March to an Unburnable Probe

David Raschko and Hadi Najar (FormFactor – USA)

Welcome to SWTest 2023

Jerry Broz, PhD
SWTest General Chair,Advanced Probing Systems

Visionary Keynote Presentation

Test in the 3D NAND Zettabyte Era: How to achieve quality and minimize cost

Luca Fasoli, PhD
Senior Vice President, Silicon Technology & Manufacturing
Western Digital, Inc.

Session #1: RF Applications

Session Chair: Mark Ojeda (Infineon Semiconductor – USA)

On Membrane Attenuators for 60 GHz Loopback Transceiver Testing

Herve Pozin-Roux, Nicolas Falcot, Philippe Tribolo, and Benoit Gubert (ST Microelectronics – France) and Andrew Nelson (FormFactor – USA)

High Speed and Fine Pitch Phantom Technology. Advanced Solution for RF Test Over 53 Gbps and Fine Pitch at 70µm

Giulia Rottoli (Technoprobe SpA – Italy) and Dale Ventura (Marvell Technology- USA)

Enabling high speed loopback tests for Serdes, PCIE Gen5/6 on Probe using embedded Capacitors on the MLO

Quaid Joher Furniturewala (Advantest America Inc. – USA)

Session #2: Probecard Optimizations

Session Chair: Michael Huebner, PhD (FormFactor – USA)

Overcoming New Challenges in Advanced Vertical Probe Card Guide Plate Drilling

Chris Stokes, Alan Ferguson PhD, and Dimitris Karnakis (Oxford Lasers Ltd – UK)

Reinventing RF Wafer Probes

Don Thompson (PTSL – USA)

Fully Automated Integrated Silicon Photonic Wafer Test

Golam Bappi (Ayar Labs – USA) and Dan Rishavy (FormFactor – USA)

Session #3: Fine Pitch & High Parallelism

Session Chair: Raffaele Vallauri (Technoprobe SpA – Italy)

Staying Ahead of the Probe Card Complexity Curve

Eric Shoemaker and Steve Ledford (Teradyne, Inc – USA)

Challenges and Innovations in Developing High-Density, Low-Power DPS Solutions for 5nm and Smaller Process Geometries in ATE

Tim Bakken (Elevate Semiconductor – USA)

MEMS Probe Cards for Advanced High-Volume Inline Process Control Monitoring (PCM) and End-of-Line Wafer-Acceptance Tests (WAT)

Choon-Leong Lou, Yu-Ming Chien, Daniel Lo, Tee Whay Lim, Jee Fong Jong, Eric Sik Kiang Lau (STAr Technologies – Taiwan)

SWT Crew Initiative and Mentoring Program

Update on SWT Crew Initiative and Mentoring Program

Karen Armendariz (Celadon Systems) and Amy Leong (FormFactor)

Session #4: RF Design Considerations

Session Chair: Karen Armendariz (Celadon Systems – USA)

Pyramid Probe: RF Calibration and Probe Aging Considerations in HVM High Speed IO Devices

Daniel Bock, PhD (FormFactor – USA) and Walter Contrata (Marvell – USA)

High Speed Probe Card architecture for High End Devices

Xin-Reng Foo and Chee Hoe Lin (AMD – Singapore)

Session #5: High Power Testing Challenges

Session Chair: Amy Leong (FormFactor Inc. – USA)

Maximizing CCC in a Probe Card and the March to an Unburnable Probe

David Raschko and Hadi Najar (FormFactor – USA)

High Heat Dissipation: Facing New Challenges with High-Power Testing at the Wafer Level

Lane Huston (Micron Technology, Inc. – USA)

Dynamic high wattage wafer test, a novel approach to keep DUT temperature constant

Klemens Reitinger (ERS electronic GmbH – Germany)

High Voltage Probing goes Multi-Site

Rainer Gaggl (T.I.P.S. Messtechnik GmbH – Austria)

Session #6: Probecard Mechanical Characteristics

Session Chair: Connie Smith (Texas Instruments)

Considerations for Vertical High Probe Count Testing

Keith Martin (FormFactor – USA)

Optimization of thermomechanical characteristics of a probe card

ChoongSik Kim, Dong Il Kim, In Buhm Chung, and Daejyeong Lee, Dooyun Chung (AMST – South Korea)

Challenges and Improvement Actions for HPC Wafer Testing

Kenny Tang and Oscar Lee (TSMC – Taiwan)

Session #7: Probe Potpourri

Session Chair: Jerry Broz, PhD (SWTest Conference Chair – USA)

Flying Probe Card Design for Medical and Other Challenging Applications

Luca Fanelli (SPEA S.p.A. – Italy)

Automotive as a key driver for Test Demand

Panchami Phadke (TechInsights Inc. – USA)

Bump test seminar and future ubump demand research

Zach Hsieh (MPI Corporation – Taiwan)

Session #8: Probecard Design Optimization

Session Chair: Patrick Mui (JEM America)

Automated multi-temperature calibration routine for prober chucks on a 300mm production wafer prober

Austin Ibele and Harald Ibele (Sigma Sensors (TCL) GmbH – Germany)

Burn-in test system controlled in real temperature

Junas Na (SEMICS – South Korea)

Thermal challenges in fine pitch testing solutions

Pang-Chi Huang, Paul Tai, and Kyle Daly (CHPT. Co., Ltd. – USA)

Poster Sessions

Session Chair: John Caldwell (MJC Electronics Corporation – USA)