SWTest 2024 Program

Jerry Broz, PhD
SWTest General Chair, SWTest Conference, USA

Known Good Die as a Key Enabler for Advanced Packaging in a Disaggregated World

Joseph Parks, PhD
Vice President of Technology Development and Director of Oregon Assembly Test Development Factory, Intel Corporation - USA

Packaging Trends in the Power Semiconductor Market

Joseph Roybal
Senior Vice President of Global Backend Operations, Wolfspeed, Inc. - USA

Visionary Keynote Presentation was not shared by Joe Roybal.

Narrow Pitch Impedance Standard Substrates (ISS) for Pyramid Probe Applications

Pratik Ghate (FormFactor, Inc. - USA)

Characterization of High Performance RF Vertical Probe Heads

Daniel Bock (Probe Test Solutions Limited - USA)

Next Generation Probe Card Design for 112Gbps PAM4 Test Solution

Johnson Tseng (Chunghwa Precision Test Tech. Co., Ltd. - USA), Jhih-Hong Cheng, Kimmie Chen (Chunghwa Precision Test Tech. Co., Ltd. - Taiwan)

Risk Mitigation Strategies for mmWave Production Test Environments

Kevin Ayers, Ryan Garrison (FormFactor, Inc. - USA)

Probe Heads for Optical Wafer-Level Testing

Philipp Dietrich, Andrés Machado, Florian Rupp (Keystone Photonics GmbH - Germany)

Novel direct probe solution for opto-electronic wafer-level PIC testing

Golam Bappi (Ayar Labs - USA), Tobias Gnausch (Jenoptik Optical Systems GmbH - Germany)

Optical edge coupling method for fully automated PIC wafer-level testing

Anna Peczek (IHP Leibniz-Institut für innovative Mikroelektronik - Germany), Dan Rishavy (FormFactor, Inc. - USA)

Probing Technologies for KGD Testing: Choosing Between Needle Probes and Pogo Pins

Michael Lawson, Luca Fanelli, Sara Monfreda (SPEA S.p.A. - Italy)

Newly developed low CTE LTCC material for ST substrates

Noriyuki Yoshida, Eiichi Nakamura, Shigekatsu Kono, Takahisa Yamaguchi (Nippon Electric Glass Co., Ltd. - Japan)

Advanced Packaging from a probe card suppliers’ perspective

Gabriela Pereira (Yole Group - France), John West (Yole Group - United Kingdom)

Towards Ultra-High Pin Count Probe Card for high end logic devices

Alice Ghidoni, Elia Missaglia (Technoprobe SpA - Italy)

Advanced Probe Card Solutions to address HBM wafer and stacked die test challenges

David Cooke, Kalyanjit Ghosh (FormFactor, Inc. - USA)

When wafer test probes meet Femtosecond Laser micro cutting and turning

Valentin Beuchat (Posalux SA - Switzerland)

Anisotropy in High-Strength Palladium Alloys for Foil Probe Applications

Patrick Bowen, Grant Justice, Megan Puglia (Deringer-Ney Inc - USA)

Singulated Die Sort as a tool to enable high precision thermal control during high-volume manufacturing

Jaime Sanchez, Matthew Zeman (Intel Corporation - USA)

Challenges of Heat Generation in Probe Cards

Kurt Guthzeit, Emmett Ricks (Micron - USA)

300mm Probe card for Logic device with wide temperature range testing

Dong Il Kim, Choong Sik Kim, Il Du Kim, Jin Hyang Heo (AMST Co. - South Korea), Mark Ojeda, Phuc Do (Infineon Technologies AG - USA)

Fully integrated probes made by µ3D printing for customizable, fine-pitch test solutions

Edgar Hepp, Wabe Koelmans, Francesco Colangelo, Patrik Schürch (Exaddon - Switzerland), Mathieu Achard, Raphaël Ruetsch (Synergie Cad - France), Sam Lin (Xsquare - Taiwan)

Unlocking Secrets: Enhancing Semiconductor Testing with Pd-Cu-Ag Alloys

Lea Lumper, Verena Maier-Kiener (Montanuniversität Leoben - Austria), Andreas Stark (Helmholtz-Hereon - Germany)

Digital Lithography Enhances Fine Pitch Probe Cards Performance

Ksenija Varga, Holly Roman, Uhrmann Thomas, Zenger Tobias (EV Group - Austria), Janssen Dimitri, Reybrouck Mario, Van Herck Niels, Vanclooster Stefan, Vandevyvere Marieke (Fujifilm Electronic Materials - Belgium)

Spike Safe Floating VI Design & Associated FET Testing Methods

Ramana Tadepalli (Texas Instruments - USA)

Study of contamination and key parameters in wafer probe card testing

Cédric Hermet (STMicroelectronics - France), Salvatore De Siena (Technoprobe SpA - Italy)

Probe technologies compared - introducing TIPS' new RzBeam and a universal metric for scrub

Diana Damian, Georg Franz (T.I.P.S. Messtechnik GmbH - Austria)

Machine learning based wafer sort yield prediction based on wafer acceptance test data

Yin Hong Chan, Amalini Mansor, Changqing Chen, Jia Yi Chua, Man Hon Thor, Yong Keong Teoh (GlobalFoundries - Singapore)

Advancing ATE with ElevATE’s Modular Silicon Strategy

Kurt Erikson (Elevate Semiconductor - USA)

Known Good Die - Best Practice for Probing High Power Devices

Sebastian Salbrechter, Diana Damian, Rainer Gaggl (T.I.P.S. Messtechnik GmbH - Austria)

On Probe Card Cleaning: The Interplay of Materials Science and Tribology

Brian Green, Kenneth Boblak (Entegris - USA)

A comparison of Nanosecond, Picosecond and Femtosecond laser sources and their manufacturing capabilities in Guide Plate production

Chris Stokes, Greg Harris, Dimitris Karnakis, Tuohy Simon (Oxford Lasers Ltd - United Kingdom)

Enhancing Interposer Design for High Pin Count Probe Cards

Jay Kim (OKins Electronics - USA)

Enhancing High-Speed Testing Performance of RF Probe Cards through Low Dielectric Polyimide Materials

Tae Kyun Kim, Yong Ho Cho, Yoo Seok Jung (Protec MEMS Technology - South Korea)

Automation of Large and Heavy Probe Card Exchange, Handling and Storage

Benedikt Pongratz (Turbodynamics - USA)