Time	Event
7:30 - 9:30	EXPO Move-in
7:30 - 17:30	Attendees Registration Check-In
8:45 - 9:15	Fukuoka Governor Welcome Jerry BROZ (SWTest Conference Chair, USA)
9:15 - 10:00	Visionary Keynote Silicon Seabelt 2.0: Challenges of Kyushu for Reproduction of Silicon Island Hiroto YASUURA National Institute of Information - Japan
10:00 - 10:30	Break
10:00 - 10:30	Poster Session Nyi Nyi THEIN (Western Digital Corporation , Japan)
10:00 - 17:30	EXPO Open
10:30 - 12:00	Session 1 Practical Test Solutions from MEMS, Power, and Optical Session Chair: Eric Chia-Cheng CHANG (Intel, USA)
10:30 - 11:00	Novel True-Kelvin MEMS Analytical DC Probes to enable Accurate and Repeatable Characterization of Advanced-Node devices for AI applications Choon Beng SIA (FormFactor Inc - Singapore), Masa WATANABE (FormFactor Japan - Japan)
11:00 - 11:30	Consideration of Resistance with Shared Power line for High Current device Shoichi MATSUO (Micron Memory Japan Inc. - Japan)
11:30 - 12:00	From Lab to Line: Enabling Efficient PIC Testing for Mass Production Andrew YICK, Andy CHANG, Calvin YANG, Supreet KHANAPET (Marvell - USA), Christian KARRAS, Tobias GNAUSCH (Jenoptik - Germany)
12:00 - 14:00	Lunch
14:00 - 15:30	Session 2 Innovative Testing Solutions for High-Performance Devices Session Chair: Clark LIU (MJC Taiwan, Taiwan)
14:00 - 14:30	Addressing High-Speed Devices: Strengthening and Advancing MEMS Probe Cards Masataka KIMOTO (MICRONICS JAPAN CO.,LTD - Japan), Yuka HOMAN (MICRONICS JAPAN CO.,LTD. - Japan), Shinji TANAKA (MICRONICS JAPAN - Japan)
14:30 - 15:00	A novel memory test system with an electromagnet for STT-MRAM wafer level testing Masaharu TSUTA (Tohoku University - Japan), Masatomo TAKAHASHI (Accretech - Japan)
15:00 - 15:30	100+K Ultra HIGH Pin Count Probe Card Zach HSIEH (MPI Corporation - Taiwan)
15:30 - 16:00	Break
15:30 - 16:00	Poster Session Nyi Nyi THEIN (Western Digital Corporation , Japan)
16:00 - 17:30	Session 3 Challenges of Advanced Devices and Complex Systems Session Chair: Alan FERGUSON (Oxford Lasers, United Kingdom)
16:00 - 16:30	A Cost-Effective Test Solution for Parametric Test & Reliability Lab Adam KONICEK (Celadon Systems, Inc. - USA), Ching Too CHEN, Jeff GRUSZYNSKI, Chintankumar PATEL, Jocelyn HSIEH, Jonathon LEE (Chroma ATE, Inc. - USA)
16:30 - 17:00	Automated Test Equipment for Battery Management Systems: Challenges and Solutions Sandeep D'SOUZA (Elevate Semiconductor - USA)
17:00 - 17:30	Probing challenge New MEMS probe design to control probe creep/fatigue for high temp probing. Hiroki KITAMURA, Tomonao NAKASHIMA (Japan Electronic Material Corp - Japan)
17:30 - 20:00	Kagamiwari Ceremony & Welcome Reception

Poster Session

• Advanced DUT protection during Avalanche testing on wafer level
  Ondrej BETAK, Zdenek SIMERSKY (UNITES Systems a.s. - Czech Republic)
• More effective high voltage(1,000V) parametric test technique with MEMS probe card
  Takao SAEKI (FormFactor Inc - Japan)
• New Cleaning Sheet filled with abrasive gel in all cells of melamine sponge.
  Tad ROKKAKU (Probe Innovation USA, LLC - USA)
• Towards Ultra-High Pin Count Probe Card for high end logic devices
  Alice GHIDONI, Elia MISSAGLIA (Technoprobe Spa - Italy)
• Adjusting Device Temperature Measurement using a Thermocouple Probe Card
  Hiroyuki NAKAMURA (Nidec SV Probe - Japan)
• Power supply characteristics of Printed Wiring Boards for low-voltage, high-speed device testing
  Wai Kit K (Lincstech Co., Ltd. - Japan)
• Enhancing High-Density Semiconductor Testing with Dual-Head Laser Micro Bonding and Vacuum Gripper Technology
  Gi Jung NAM, HONG CHUL KIM (DAWON NEXVIEW - South Korea)
• A Comprehensive Study on Improving Probe Card Transmission Lines for Effective High-Frequency Wafer-Level Testing
  Alessia GALLI, Dario VILLA (Technoprobe - Italy)
• New Flying Probe Tester for Probe Cards
  Koichi ANDO (HIOKI E.E. CORPORATION - Japan)
• Development of low CTE LTCC material for ST substrates
  Takahisa YAMAGUCHI, Eiichi NAKAMURA, Noriyuki YOSHIDA, Shigekatsu KONO (Nippon Electric Glass Co.,Ltd. - Japan)
• Introduction of precious metal alloy for Probe-pins materials and mechanical properties of Cu-Ag alloy that product name called TK-101.
  Tetsuya KATO, Suganuma RYOSUKE, Takada KAZUYASU (TANAKA KIKINZOKU KOGYO K.K. - Japan)
• Testing AI chips and KGD at wafer-level: A new approach for full content test in wafer probing
  Klemens REITINGER (ERS electronic GmbH - Germany)
• Productivity Enhancements when Drilling Guide Plates for Advanced Vertical Probe Cards - A Comparison between Nanosecond, Picosecond and Femtosecond Pulsed Lasers
  Alan FERGUSON, Chris STOKES (Oxford Lasers - United Kingdom)
• ATE Spring Pin to DUT Board Via Interconnect: Myths and Challenges
  Jose MOREIRA (Advantest - Germany)
• Wafer test with simultaneous stimulation of sensor devices
  Georg FRANZ (T.I.P.S. Messtechnik GmbH - Austria)
• Process for Integrating MLOs Manufactured on Digital Lithography Systems
  Ksenija VARGA, R HOLLY, T UHRMANN, T ZENGER (EV Group - Austria), C LEE, Y KUO (EV Group - Taiwan), C WANG, H CHANG, L CHANG, T YANG (ITRI Industrial Technology Research Institute - Taiwan), D JANSSEN, M REYBROUCK, M VANDEVYVERE, N VAN HERCK, S VANCLOOSTER (FUJIFILM Electronic Materials (Europe) - Belgium)
• Hybrid Bonding Technology for Next-Generation 3D-IC/Chiplets
  Takafumi FUKUSHIMA, Fukushima TAKAFUMI (Tohoku University - Japan)
• 3D-IC Fabrication with TSV at the die level from 2D-IC
  Jiayi SHEN, Jlayi SHEN (Tohoku University - Japan)
• Robust Classifications of WBM Defect Patterns -Multimodal approach　
  Taiki AI, Daisuke TAKADA, Koichi SUMIYA, Sumika ARIMA, Taiki ITO, Takumi MAEDA (University of Tsukuba - Japan)
• Interaction Modeling of High-dimensional Data with the Bias and High Correlation -Sparse Factorization Machines Approach.
  Haruki OZAWA, Sara HOSHINO, Sumika ARIMA, Sumika WATANABE, Taiki ITO, Takuya MATSUZAWA (University of Tsukuba - Japan)

Poster Session